Data Centers Part III: The Rebirth of U.S. Semi Manufacturing – The Drive to Thrive
By: Krish Sankar, Matthew D. Ramsay, Joshua Buchalter CFA, Eddy Orabi, Steven Chin
Jul. 10, 2024 - 2 minutesThe TD Cowen Insight
Our supply model indicates that the U.S. potentially has enough capacity to meet domestic demand for leading-edge chips by the end of the decade, but higher operating costs and talent scarcity are some challenges. Semicaps are key beneficiaries from the cumulative USD 40 billion in Wafer Fab Equipment (WFE) required to reach that goal.
Our Thesis
The move to rebuild the semiconductor ecosystem in the U.S. comes amid the rising importance of leading-edge semis from both a strategic and economic standpoint. While there are some challenges, based on our proprietary U.S. wafer capacity model along with our forecast for U.S. domestic needs, we believe the U.S. should have enough capacity to meet its domestic demand for leading-edge semis by the end of the decade. However, capacity availability is only one factor of what is required to achieve actual adequacy in leading-edge chips. Other factors that we discuss in this report include wafer pricing, fabrication economics, talent availability, labor turnover and availability of packaging facilities. The intent here is not to arrive at a conclusion whether the U.S. endeavor will succeed in its efforts or not, but rather to help investors better understand what is required for the U.S. to reach a level of adequacy in leading-edge chips.
What Is Proprietary
We developed a proprietary supply-demand analysis and a fabrication construction framework. We then applied it to a leading semiconductor manufacturing company to better understand the economics between operating a fabrication in the U.S. versus Taiwan and identify opportunities to improve chip costs longer-term. Our wafer supply and demand model for U.S. leading-edge chip consumption offers additional granularity on when and how much the U.S. needs to spend to achieve supply adequacy.
What To Watch
- Production ramp for U.S. fabrications later in 2024 and into 2025, and the equipment facilitation in the 2026-27 timeframe, can provide a gauge for U.S. progress on reaching wafer supply goals.
- Approximately 75% of grants under the Creating Helpful Incentives to Produce Semiconductors (CHIPS) Act are already awarded, but these awards are non-binding. The amount and timely distribution of these funds are critical.
- Potential CHIPS Act 2.0 program for fabrications beyond 2030 could be a catalyst for semicap stocks.
- Announcements for new capacity and spending by outsourced semis assembly and test (OSATs) for back-end packaging and testing that complement front-end foundries reflects the level of interest from end customers in making chips in the U.S.
Subscribing clients can read the full report, The Next Datacenter Decade, Driven By Acceleration & GenAI - Ahead Of The Curve, on the TD One Portal